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IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.
Lightning protection system components (LPSC) - Part 1: Requirements for connection componentsstandard by International Electrotechnical Commission, 03/01/2023
Digital addressable lighting interface – Part 253: Particular requirements – Diagnostics and maintenance (device type 52)standard by International Electrotechnical Commission,...
Industrial communication networks - Fieldbus specifications - Part 5-4: Application layer service definition - Type 4 elementsstandard by International Electrotechnical...
Medical electrical equipment - Part 2-2: Particular requirements for the basic safety and essential performance of high frequency surgical equipment...